JPH0735278Y2 - 高周波リレー - Google Patents
高周波リレーInfo
- Publication number
- JPH0735278Y2 JPH0735278Y2 JP1988154103U JP15410388U JPH0735278Y2 JP H0735278 Y2 JPH0735278 Y2 JP H0735278Y2 JP 1988154103 U JP1988154103 U JP 1988154103U JP 15410388 U JP15410388 U JP 15410388U JP H0735278 Y2 JPH0735278 Y2 JP H0735278Y2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- terminal
- fixed
- base
- spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000510 noble metal Inorganic materials 0.000 claims description 9
- 239000007769 metal material Substances 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 7
- 239000010970 precious metal Substances 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Landscapes
- Contacts (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988154103U JPH0735278Y2 (ja) | 1988-11-25 | 1988-11-25 | 高周波リレー |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988154103U JPH0735278Y2 (ja) | 1988-11-25 | 1988-11-25 | 高周波リレー |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0274745U JPH0274745U (en]) | 1990-06-07 |
| JPH0735278Y2 true JPH0735278Y2 (ja) | 1995-08-09 |
Family
ID=31430535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988154103U Expired - Lifetime JPH0735278Y2 (ja) | 1988-11-25 | 1988-11-25 | 高周波リレー |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0735278Y2 (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2930465B2 (ja) * | 1992-02-10 | 1999-08-03 | 富士通株式会社 | 電磁継電器 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5957834U (ja) * | 1982-10-07 | 1984-04-16 | オムロン株式会社 | 高周波開閉用電磁継電器の接点構造 |
| JPS6142740U (ja) * | 1984-08-24 | 1986-03-19 | 松下電工株式会社 | 小形スイツチ |
-
1988
- 1988-11-25 JP JP1988154103U patent/JPH0735278Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0274745U (en]) | 1990-06-07 |
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